Thermal Management Materials and Technologies
To address the increased heat generation in hardware expanding in future society such as EVs, AI servers, and power semiconductors, we aim to develop heat dissipation materials that achieve both lightweight, high thermal conductivity, and thinness. We seek materials and technologies that can create new thermal management solutions through fusion with our polymer design technology.
Learn MoreFeatured Materials & Technologies
High thermal conductivity polymer composite materials (e.g., graphene/BN-filled resins), temperature stabilization technology using phase change materials (PCM), heat dissipation paints and coating technologies utilizing nanostructures, etc.